|모집분야/업무||CMOS Analog Designer 외|
|기타사항||Broadcom Inc. is a leading designer, developer and global supplier of a broad range of analog and digital semiconductor connectivity solutions. We combine global scale, engineering depth, broad portfolio diversity, superior execution and laser-like operational focus to deliver category-leading connectivity products so our customers can build and grow successful businesses today and in the future.
Our employees passion for excellence and innovation is our most prized resource. If you share that passion — and want to be part of a company at the forefront of the communications revolution — we want to hear from you.
Broadcom Inc. is committed to creating a diverse work environment and is proud to be an equal opportunity employer.
■ 모집 부분
1. CMOS Analog Designer
- A bachelor or master degree in Electrical/Electronic Engineering
- 5+ years of experience in analog & mixed signal IC design ( high RF understanding is a plus )
- A strong technical background in design, simulation and verification of semiconductor electronic circuits.
- Good understanding of Bi/CMOS devices.
- Solid understanding of integrated circuits functionality and design techniques.
2. Reliability Engineer (전기/전자,반도체공학,신뢰성공학 관련 전공 석사이상)
- Reliability Test (Environment, Lifetime test) 에 대한 이해
- Die/Package/Substrate process이해
- RF Device (PA amplifier, Filter)대한 이해
- 영어 communication skills
3. Product engineer
• Knowledge : Sufficient knowledgeable and verifiable of the test plan, test limit used for mass production. fully understanding of the operating principles of LNA, Filter, switch and PA. Evaluates reliability of materials, properties and techniques used in production
• communication : Discuss with R&D(Seoul, SJ), production team(Penang) during product development stage to prevent manufacturing & quality problems during mass production ramp.
• Ability : to identify and resolve the cause with team members in case of a problem • Experience : Bachelors and 8+ years of related experience or Masters degree and 6+ years of related experience or PhD and 3+ years of related experience
- 학사이상 (전기, 전자 관련 RF전공자) / RF관련 업무 경력자
- RF관련지식 보유자 / RF Device (FEM, PA, Filter, switch, LNA)에 대한 이해
- 프로그램 개발 경험자(C#, C++) 우대
- 영어소통능력 상급 우대
4. Failure Analysis Engineer
The Failure Analysis Engineer will primarily be tasked with performing failure analysis on field returns, qualification failures, yield failures, and new development on RF module products.
These analyses efforts usually will involve electrical characterization and localization of the failure, physical analysis to determine the exact correctible cause whenever necessary, and communication of results in both written and oral form.
Role and Responsibilities:
-Perform preliminary failure analysis as needed, including: external visual examination,
scanning acoustic microscopy, 3D X-ray and IV curve etc…
-Perform fault isolation to identify failure mechanisms(s) utilizing schematics, layouts, BSIR, FIB, PEM, OBIRCH etc
-Perform physical analysis to find fail location through vertical & horizontal cross-section, chemical de-capsulation.
-Develop, characterize, and optimize FA techniques and tools to advance FA capabilities and efficiency.
-Work with designers and other team to isolate root cause of failures.
-Generate detailed failure analysis reports for both internal and external customers.
Minimum Qualifications (Experience and Skills):
6 years of experience in failure analysis engineering, reliability engineering.
5. Hardware Engineer
- chip top simulation (RF+Analog+Digital)
- chip top PEX (post layout) simulation
: Rx/Analog performance, Vdd / digital 회로에서 RF회로에 커플링되는 noise
- EM simulation : RFIC EM simulation (EMX, Momentum,..), PCB EM simulation (HFSS, Momentum)
- Hybrid simulation: chip top + PCB
- RF/Analog 회로의 digital control 이해
- Digital block PnR 및 Timing 이해
■ 채용 조건
주 5일 근무 (주 40시간) / 연봉은 협의 후 결정 (동종업계 최상위)
■ 근무 지역
서울시 서초구 양재2동 215 하이브랜드 빌딩 리빙관 8층
■ 접 수
1) 기 간: ASAP(빠른 지원을 하시면 면접시 유리)
2) 지원방법: 지원하고자 하는 분야를 반드시 이메일 제목에 명시하여 채용 담당자의 이메일로 직접 지원하십시요 firstname.lastname@example.org
3) 제출서류: MS Office나 PDF로 작성한 국문&영문 이력서 및 국문 혹은 영문 경력 기술서를 반드시 하나의 파일로 만들어 보내주십시요.
■ 전형 방법
2) 1차/2차 실무면접 (서류심사 합격자에 한하여 면접 일정 개별 통보)
3) 최종 임원면접
■ 복리 후생
Competitive Benefit Package
국민건강보험 전액 지원, 식대 및 교통비 지원, 직계 가족 의료비 지원, 경쟁력 있는 퇴직연금 제도 등
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